電析ニッケルめっき膜へのアミノ酸の共析  [in Japanese] Codeposition of Amino Acids in the Electrodeposited Nickel Films  [in Japanese]

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Author(s)

Abstract

Using amino acids as additives, Ni films were fabricated by electroplating in a Watts bath. The amino acids affected the Ni film composition, surface morphology, crystal structure, hardness, and the codeposition mechanism.<br>The addition of S-containing amino acids such as methionine, aromatic amino acids such as tryptophan, and basic amino acids such as lysine, histidine, and arginine to the plating bath led to incorporation of C with the Ni films. The C contents in the plated film increased. The grain size decreased concomitantly with increasing amino acid concentration in the plating bath. The Ni film hardness increased with grain size refinement up to 10-15 nm. Maximum hardness of about 500-550 Hv was obtained irrespective of the amino acid type. This investigation revealed that, for the codeposition mechanism with arginine, the arginine was decomposed. The codeposited C was present in an atomic state in the film.

Journal

  • Journal of The Surface Finishing Society of Japan

    Journal of The Surface Finishing Society of Japan 66(2), 59-64, 2015

    The Surface Finishing Society of Japan

Codes

  • NII Article ID (NAID)
    130005121709
  • NII NACSIS-CAT ID (NCID)
    AN1005202X
  • Text Lang
    JPN
  • ISSN
    0915-1869
  • NDL Article ID
    026085394
  • NDL Call No.
    Z17-291
  • Data Source
    NDL  J-STAGE 
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