Self-alignment Ability of Copper Ball on Soldering for Packaging-on-Packaging and Measurement of Oxidation Layer Thickness by Lightness Value

• Kawasaki Hiroyoshi

  Senju Metal Industry. Co., Ltd. Department of Applied Chemistry, Kyushu Institute of Technology

• Hattori Takahiro

  Senju Metal Industry. Co., Ltd.

• Roppongi Takahiro

  Senju Metal Industry. Co., Ltd.

• Soma Daisuke

  Senju Metal Industry. Co., Ltd.

• Sato Isamu

  Senju Metal Industry. Co., Ltd.

• Kawamata Yuji

  Senju Metal Industry. Co., Ltd.

• Araki Koji

  Department of Applied Chemistry, Kyushu Institute of Technology

• Tsuge Akihiko

  Department of Applied Chemistry, Kyushu Institute of Technology

抄録

Cu balls showed unique soldering behavior that was different from the conventional solder as the semiconductor devices. On soldering on pad by the solder balls, solder balls move to the center position because of their self-alignment ability. On the contrary, Cu balls tend to move to the outer position from the mounted center position. We have achieved arranging of Cu balls at the center position using their self-alignment ability. It requires a thin oxidation layer on Cu balls. We also developed the simple and easy method to measure the thickness of the oxidation layers by utilizing the lightness.

収録刊行物

• Transactions of The Japan Institute of Electronics Packaging

  Transactions of The Japan Institute of Electronics Packaging 8 (1), 162-165, 2015

  一般社団法人エレクトロニクス実装学会

キーワード

• Soldering
• Packaging-on-packaging
• Cu Balls
• Self-alignment
• Centering

詳細情報

• CRID: 1390001205314561152
• NII論文ID: 130005139872
• DOI: 10.5104/jiepeng.8.162
• ISSN: 18848028
• ISSN: 18833365
• Web Site: https://www.jstage.jst.go.jp/article/jiepeng/8/1/8_162/_pdf
• 本文言語コード: en
• データソース種別:
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