Decrease in Process Pressure for Forming Au-to-Au Joints via Reduction Reaction of Ag<sub>2</sub>O
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- Inoue Taro
- Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
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- Ogura Tomo
- Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
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- Hirose Akio
- Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University
Bibliographic Information
- Other Title
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- Decrease in Process Pressure for Forming Au-to-Au Joints via Reduction Reaction of Ag₂O
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Abstract
<p>In this study, we were able to form strong Au-to-Au joints using a silver oxide (Ag2O) paste sintered at 300℃. We successfully reduced the processing pressure applied during sintering by 0.5 MPa by optimizing the sintering conditions. Through X-ray diffraction phase analysis as well as crystallite size calculations, we observed a significant reduction (27%) in the crystallite size as the heating rate was increased from 10℃/min to 180℃/min. Scanning electron microscopy cross-sectional observations confirmed that the high heating rate facilitated sintering within the bonding layer. The bonded shear strength (maximum of 24 MPa) was higher than that of the conventional Pb-5Sn solder (18 MPa), proving the suitability of Ag2O paste as a potential lead-free bonding material for high-temperature applications.</p>
Journal
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 58 (2), 127-130, 2017
The Japan Institute of Metals and Materials
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Details 詳細情報について
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- CRID
- 1390282679229820032
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- NII Article ID
- 130005297207
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- NII Book ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL BIB ID
- 027871741
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
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- Abstract License Flag
- Disallowed