High Adhesion Plating Process for ABS Resin using Ultrafine Bubble with Low Ozonated Water

• Umeda Yasushi

  Kanto Gakuin University Research advancement and management organization Kanto Gakuin University Materials and Surface Engineering Research Institute

• Nomura Taro

  Kanto Gakuin University Materials and Surface Engineering Research Institute Department of Industrial Chemistry, College of Engineering, Kanto Gakuin University

• Nakagawa Haruyo

  Kanto Gakuin University Materials and Surface Engineering Research Institute Ebina Denka Kogyo Co.,Ltd.

• Nakabayashi Yuki

  Kanto Gakuin University Materials and Surface Engineering Research Institute Department of Industrial Chemistry, College of Engineering, Kanto Gakuin University

• Tashiro Katsuhiko

  Kanto Gakuin University Research advancement and management organization Kanto Gakuin University Materials and Surface Engineering Research Institute

• Honma Hideo

  Kanto Gakuin University Materials and Surface Engineering Research Institute

• Takai Osamu

  Kanto Gakuin University Materials and Surface Engineering Research Institute Department of Industrial Chemistry, College of Engineering, Kanto Gakuin University

Bibliographic Information

Other Title

• ウルトラファインバブルと低濃度オゾン水を使用したABS樹脂の高密着めっき法
• ウルトラファインバブル ト テイノウド オゾンスイ オ シヨウ シタ ABS ジュシ ノ コウミッチャクメッキ ホウ

Abstract

A high-adhesion plating process for ABS resin was studied using a low concentration of ozone instead of using harmful hexavalent chromium. ABS resin can be modified by ultrafine, ozone-containing bubbles dispersed in water (<2 ppm). A high adhesion strength of approximately 1 kN/m was obtained when treated for 30 min. In contrast to the conventional etching processes containing hexavalent chromium, it is not necessary to apply a problematical wastewater treatment.<br>Accordingly, this treatment could be used as a new sustainable technology in the near future.

Journal

• Journal of The Japan Institute of Electronics Packaging

  Journal of The Japan Institute of Electronics Packaging 19 (7), 492-500, 2016

  The Japan Institute of Electronics Packaging

Keywords

• Ultrafine Bubble
• Low Concentrate Ozone
• ABS Resin
• High Adhesion Plating
• Hexavalent Chromic Free

Details

• CRID: 1390001204561002368
• NII Article ID: 130005398340
• NII Book ID: AA11231565
• DOI: 10.5104/jiep.19.492
• ISSN: 1884121X
• ISSN: 13439677
• NDL BIB ID: 027746245
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I027746245
• Web Site: https://www.jstage.jst.go.jp/article/jiep/19/7/19_492/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed