微細パターン形成に適する新規マンガンめっき浴の開発  [in Japanese] Development of Manganese Plating Bath Suitable for the Fine Pattern Formation  [in Japanese]

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Author(s)

    • 依田 稔久 YODA Toshihisa
    • 新光電気工業㈱|信州大学 大学院総合工学系研究科 Shinko Electric Industries Co., Ltd.|Department of Materials Science and Engineering, Interdisciplinary Graduate School of Science and Technology, Shinshu University
    • 是津 信行 ZETTSU Nobuyuki
    • 信州大学 環境・エネルギー材料科学研究所|信州大学 工学部 環境機能工学科 Center for Energy and Environmental Science, Shinshu University|Department of Environmental Science & Technology, Shinshu University
    • 手嶋 勝弥 TESHIMA Katsuya
    • 信州大学 環境・エネルギー材料科学研究所|信州大学 工学部 環境機能工学科 Center for Energy and Environmental Science, Shinshu University|Department of Environmental Science & Technology, Shinshu University

Abstract

This work systematically examined the development of a new plating bath for fine-patterned manganese electrochemical deposition on an organic substrate under various conditions. Hull cell tests, potentiodynamic scans, and galvanostatic experiments conducted with widely diverse pH and current densities revealed that CyDTA played a critical role as a pH buffer in the formation of fine-patterned manganese films. Optimized plating conditions enabled the formation of fine-patterned manganese electrochemical deposits of 10 μm squares with 20 μm pitch.

Journal

  • Journal of The Surface Finishing Society of Japan

    Journal of The Surface Finishing Society of Japan 67(4), 211-216, 2016

    The Surface Finishing Society of Japan

Codes

  • NII Article ID (NAID)
    130005529745
  • NII NACSIS-CAT ID (NCID)
    AN1005202X
  • Text Lang
    JPN
  • ISSN
    0915-1869
  • NDL Article ID
    027278321
  • NDL Call No.
    Z17-291
  • Data Source
    NDL  J-STAGE 
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