Electric field activation technology for polishing slurry

• KUSUMI Takayuki

  Akita Industrial Technology Center

• IKEDA Hiroshi

  National Institute of Technology, Akita College.

• ECHIGOYA Masami

  Akita Industrial Technology Center

• NAKAMURA Ryuta

  Akita Industrial Technology Center

• AKAGAMI Yoichi

  Akita Industrial Technology Center

Bibliographic Information

Other Title

• 研磨スラリーの電界活性化技術

Abstract

A novel electric field activation technology was developed that improved the polishing rate of colloidal silica slurry. In general, colloidal silica slurry is used in final polishing of semiconductor substrates, such as a sapphire wafer and silicon wafer. It is a colloidal solution consisting of a stable dispersion of nanometer-size silica particles. In this study, we have developed a new nozzle that can to apply an electric field to enhance activation of colloidal silica slurry. Using this nozzle, the absolute value of the zeta potential of the silica particles became large, and the polishing rate of silicon wafer was improved by 11%.

Journal

• Journal of the Japan Society for Abrasive Technology

  Journal of the Japan Society for Abrasive Technology 61 (5), 275-276, 2017

  The Japan Society for Abrasive Technology

Keywords

• polishing
• slurry
• zeta potential
• AC electric field

Details

• CRID: 1390001204334084992
• NII Article ID: 130005679553
• DOI: 10.11420/jsat.61.275
• ISSN: 18807534
• ISSN: 09142703
• Text Lang: ja
• Data Source:
  • JaLC
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed