Development of a New Bonded Abrasive Diamond Tool

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Author(s)

    • TANAKA Hikari
    • Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University
    • SHIINA Yuta
    • Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University
    • KAMIYA Osamu
    • Department of Mechanical Engineering, Graduate school of Engineering and Resource Science, Akita University

Abstract

<p>In the development of a bonded abrasive diamond tool, it was studied that the wettability of Cu-Ag solder on carbon steel plate, gel density, maximum temperature, and holding time. The test results were evaluated by "JIS Z 3191 Method of wetting test for brazing filler metals". From the experimental results, the best conditions for producing the new diamond tool are as follows: Cu-Ag solder, 80-20(mass%); gel density, 0.2(mass%); maximum temperature, 1163 K; and holding time at maximum temperature, 300 s. A diamond jigsaw was constructed by using these processes and demonstrated that the new diamond tool could cut a brick. In addition, the degree of vacuum is important during fabrication; therefore, vacuum equipment with sufficient capacity is required for producing these tools.</p>

Journal

  • International Journal of the Society of Materials Engineering for Resources

    International Journal of the Society of Materials Engineering for Resources 21(1_2), 11-15, 2016

    The Society of Materials Engineering for Resources of JAPAN

Codes

  • NII Article ID (NAID)
    130005877873
  • Text Lang
    ENG
  • ISSN
    1347-9725
  • Data Source
    J-STAGE 
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