Development of a New Bonded Abrasive Diamond Tool

DOI Web Site Web Site 1 Citations 3 References Open Access
  • TANAKA Hikari
    Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University
  • SHIINA Yuta
    Department of Mechanical Engineering, Faculty of Engineering and Resource Science, Akita University
  • NAKATSU Masanobu
    Sanwa Tekki Corporation
  • KAMIYA Osamu
    Department of Mechanical Engineering, Graduate school of Engineering and Resource Science, Akita University

Search this article

Abstract

<p>In the development of a bonded abrasive diamond tool, it was studied that the wettability of Cu-Ag solder on carbon steel plate, gel density, maximum temperature, and holding time. The test results were evaluated by “JIS Z 3191 Method of wetting test for brazing filler metals”. From the experimental results, the best conditions for producing the new diamond tool are as follows: Cu-Ag solder, 80-20(mass%); gel density, 0.2(mass%); maximum temperature, 1163 K; and holding time at maximum temperature, 300 s. A diamond jigsaw was constructed by using these processes and demonstrated that the new diamond tool could cut a brick. In addition, the degree of vacuum is important during fabrication; therefore, vacuum equipment with sufficient capacity is required for producing these tools.</p>

Journal

Citations (1)*help

See more

References(3)*help

See more

Related Projects

See more

Keywords

Details 詳細情報について

Report a problem

Back to top