書誌事項
- タイトル別名
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- Improvement in Adhesion between Polytetrafluoroethylene(PTFE)and Electroless-Plated Copper Film Using Heat-Assisted Plasma Treatment
- ネツ アシストプラズマ ショリ ニ ヨル ポリテトラフルオロエチレン ト ムデンカイ ドウメッキ マク ノ ミッチャク セイコウ ジョウ
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抄録
<p>Atmospheric pressure plasma treatment and surface graft polymerization were applied to a polytetrafluoroethylene(PTFE)sheet to improve adhesion strength between the PTFE sheet and electroless-plated Cu film. The surface temperature of the PTFE sheet during plasma treatment was adjusted via applied radio-frequency(RF)power for plasma treatment. For applied RF power at 25 W, the maximum surface temperature was ca. 100 ℃. For applied RF power at 65 W, the maximum surface temperature was ca. 280 ℃, which is designated as “heat-assisted plasma treatment”. The adhesion strength between the plasma-treated PTFE sheet and electroless-plated Cu film was measured using a 90 degree peel test. The average adhesion strength of the plasma-treated PTFE at 25 W was 0.6 N/mm. In contrast, the adhesion strength of the plasma-treated PTFE at 65 W was 1.9 N/mm. This value was much higher than the target value(0.65 N/mm)for printed circuit boards. Heat-assisted plasma treatment drastically improved the adhesion properties of PTFE.</p>
収録刊行物
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- 表面技術
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表面技術 67 (10), 551-556, 2016
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390282679095992064
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- NII論文ID
- 130006109991
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- NII書誌ID
- AN1005202X
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- ISSN
- 18843409
- 09151869
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- NDL書誌ID
- 027683028
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可