Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface

• Nomura Akio

  Keio University

• Matsushita Yusuke

  Keio University

• Kadomoto Junichiro

  Keio University

• Matsutani Hiroki

  Keio University

• Kuroda Tadahiro

  Keio University

• Amano Hideharu

  Keio University

抄録

A wireless inductive coupling ThruChip Interface (TCI) is a flexible system-in-package (SiP) technique which enables to build a powerful interconnection network between stacked chips. For easy use of TCI, we have developed intellectual properties (IPs), and proposed an interconnection network which can make the use of IPs. We also developed a real chip embedded the IP, and evaluated the performance. By stacking multiple chips with the proposed IP, an inter-chip network with link-to-link flow control by piggyback control is established. The new proposed escalator network which uses piggyback of the credit packets outperforms the ring network used in the first prototype by 28%-59% in terms of throughput. The performance overhead by the piggyback control was less than 3%-4% of that without control messages.

収録刊行物

• International Journal of Networking and Computing

  International Journal of Networking and Computing 8 (1), 124-139, 2018

  IJNC編集委員会

詳細情報

• CRID: 1390282680726974720
• NII論文ID: 130006309780
• DOI: 10.15803/ijnc.8.1_124
• ISSN: 21852847
• ISSN: 21852839
• Web Site: https://www.jstage.jst.go.jp/article/ijnc/8/1/8_124/_pdf
• 本文言語コード: en
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