Interfacial Microstructure and Hardness of Magnetic Pulse Welded Copper/Nickel Lap Joint

• Watanabe Mitsuhiro

  Department of Precision Machinery Engineering, College of Science and Technology, Nihon University

• Ishiuchi Kentaro

  Tokyo Institute of Technology

• Kumai Shinji

  Department of Materials Science and Engineering, School of Materials and Chemical Technology, Tokyo Institute of Technology

抄録

Copper/nickel joint was fabricated using magnetic pulse welding and the interfacial microstructure was examined. Hardness change close to the welding interface was investigated by using a nanoindentation tester. Characteristic wavy morphology was formed at the welding interface. TEM observations and STEM-EDX analyses revealed that approximately 100 nm-diameter-fine grains of Cu-Ni solid solution were formed at both of copper and nickel regions in the vicinity of the welding interface. Remarkable hardness increase was detected at the vicinity of the welding interface in the nickel side, whereas hardness was constant in the copper side. The hardness increase is considered to be due to the combined effect of solid-solution strengthening and grain refinement strengthening.

収録刊行物

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 59 (3), 425-431, 2018

  公益社団法人 日本金属学会

キーワード

• magnetic pulse welding
• copper/nickel joint
• interface
• microstructure
• hardness

詳細情報

• CRID: 1390282679230719360
• NII論文ID: 130006400675
• NII書誌ID: AA1151294X
• DOI: 10.2320/matertrans.m2017289
• ISSN: 13475320
• ISSN: 13459678
• NDL書誌ID: 028849639
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I028849639
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/59/3/59_M2017289/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• 抄録ライセンスフラグ: 使用不可