Plasma Materials Processing Involving Liquid

• SHIRAFUJI Tatsuru

  Department of Physical Electronics and Informatics, Osaka City University Water Frontier Science & Technology Research Center (W-FST), Research Institute for Science & Technology, Tokyo University of Science

Bibliographic Information

Other Title

• 液体が関与するプラズマ材料プロセシング
• エキタイ ガ カンヨ スル プラズマ ザイリョウ プロセシング

Abstract

In materials processing using plasma in contact with liquid, plasma plays an important role as a trigger to promote primary processes at the plasma/liquid interface. However, direct effects such as radicals from plasma vanish after traveling a few or a few 10 nm from the plasma/liquid interface. The rest of the processes in liquid proceed only deep inside the liquid where the direct effects of plasma are no longer expected. This situation can be regarded as robustness in the process. However, at the same time, it has a negative aspect of poor controllability by plasma. In other words, the factor of “the unique to plasm” governs only the limited part of a whole process. In this paper, we survey recent research activities on materials processing using plasma in contact with liquid from the view point mentioned above, and discuss why we use plasma.

Journal

• Vacuum and Surface Science

  Vacuum and Surface Science 61 (3), 119-130, 2018

  The Japan Society of Vacuum and Surface Science

Keywords

• plasma
• liquid
• interface
• material
• processing

Details

• CRID: 1390001206124822144
• NII Article ID: 130006476137
• NII Book ID: AA12808657
• DOI: 10.1380/vss.61.119
• ISSN: 24335843
• ISSN: 24335835
• NDL BIB ID: 028905568
• Web Site: http://id.ndl.go.jp/bib/028905568
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I028905568
• Web Site: https://www.jstage.jst.go.jp/article/vss/61/3/61_20180041/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed