Si-Photonics-Based Layer-to-Layer Coupler Toward 3D Optical Interconnection

• NISHIYAMA Nobuhiko

  Tokyo Institute of Technology

• KANG JoonHyun

  Tokyo Institute of Technology

• KUNO Yuki

  Tokyo Institute of Technology

• ITOH Kazuto

  Tokyo Institute of Technology

• ATSUMI Yuki

  Tokyo Institute of Technology

• AMEMIYA Tomohiro

  Tokyo Institute of Technology

• ARAI Shigehisa

  Tokyo Institute of Technology

Abstract

To realize three-dimensional (3D) optical interconnection on large-scale integration (LSI) circuits, layer-to-layer couplers based on Si-photonics platform were reviewed. In terms of optical cross talk, more than 1 µm layer distance is required for 3D interconnection. To meet this requirement for the layer-to-layer optical coupler, we proposed two types of couplers: a pair of grating couplers with metal mirrors for multi-layer distance coupling and taper-type directional couplers for neighboring layer distance coupling. Both structures produced a high coupling efficiency with relatively compact (∼100 µm) device sizes with a complementary metal oxide semiconductor (CMOS) compatible fabrication process.

Journal

• IEICE Transactions on Electronics

  IEICE Transactions on Electronics E101.C (7), 501-508, 2018-07-01

  The Institute of Electronics, Information and Communication Engineers

Keywords

• Si photonics
• 3D optical interconnection
• layer-to-layer coupler
• grating

Details

• CRID: 1390001288039581568
• NII Article ID: 130007386829
• DOI: 10.1587/transele.e101.c.501
• ISSN: 17451353
• ISSN: 09168524
• Web Site: https://www.jstage.jst.go.jp/article/transele/E101.C/7/E101.C_501/_pdf
• Text Lang: en
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles
  • KAKEN
• Abstract License Flag: Disallowed