高周波誘導加熱を用いた廃基板からの金属回収

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タイトル別名
  • Separation and Recovery of Metallic foil from Waste Circuit Boards Using Induction Heating
  • （銅箔の加熱挙動）
  • (Heating Behavior of Thin Copper Films)

抄録

Circuit boards used in electronic devices contain various high conductive metals. In our research, separation and recovery of the metals from waste circuit board by induction heating is investigated. It is necessary to optimize the heating conditions, but the mechanism of induction heating of the circuit boards i.e., high conductive metallic foil, has not clarified. Therefore, induction heating using thin copper films under several conditions is performed and these heating behaviors are compared and evaluated. Shape of copper films of different thickness is prepared and coil current of induction heating is changed from 30 to 300 A. It is thought that heat generation by induction heating is related to magnetic flux density passing through the sample, then angles between normal vector of the sample plane and direction of magnetic flux are also used as experiment parameter. From experimental results, the specimen temperature increases with decreasing in the angle. This tendency becomes more pronounced as the thickness of the sample increases. For relatively thick sample, the surface reaches around 700℃ after all when the coil current increases.

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