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- Yang Bolun
- 東工大
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- Li Zidi
- 東工大
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- 伏信 一慶
- 東工大
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- 安井 竜太
- (株)メイテック
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- 篠田 卓也
- (株)デンソー
書誌事項
- タイトル別名
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- Heat dissipation measurement technique for semiconductor devices on printed circuit boards by using heat flux sensors
抄録
<p>As electronic devices become simultaneously smaller and faster, thermal management for such products requires innovative solutions, which should take into consideration ever more stricter size constraints. However, form factor is not the only challenge in designing such cooling systems, as the evaluation of cooling performance also relies on the power output of the device being cooled. Given the increased complexity in nowadays IC components (e.g. BGA's, FPGA's, FET's), properly determining their power dissipation became a challenge. Thus, this work focuses on a novel method for measuring power dissipation of higher complexity electronic devices, by employing a novel heat flux sensor in conjunction with analytical thermal models.</p>
収録刊行物
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- 熱工学コンファレンス講演論文集
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熱工学コンファレンス講演論文集 2018 (0), 0122-, 2018
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390845713063902848
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- NII論文ID
- 130007637674
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- ISSN
- 2424290X
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可