A high-pass filter based on through-silicon via (TSV)

• Wang Fengjuan

  School of Automation and Information Engineering, Xi’an University of Technology

• Huang Jia

  School of Automation and Information Engineering, Xi’an University of Technology

• Yu Ningmei

  School of Automation and Information Engineering, Xi’an University of Technology

抄録

A fourth-order high-pass filter is proposed, which is formed by spiral inductors and TSV capacitors. The components of this filter rely on the TSV technology, which is generally regarded as vertical interconnection but now used to compose capacitor. The comparison of the results between finite element method and equivalent electric circuit obviously proves that they have nearly equal filtering characteristics including cut-off frequency and roll-drop rate. Moreover, the comparisons are made among the HPFs based on different technologies, and the challenges the proposed HPF faces are discussed.

収録刊行物

• IEICE Electronics Express

  IEICE Electronics Express 16 (10), 20190098-20190098, 2019

  一般社団法人 電子情報通信学会

キーワード

• through-silicon via (TSV)
• high-pass filter
• three-dimensional integrated circuit (3D IC)

詳細情報

• CRID: 1390564238092381696
• NII論文ID: 130007653319
• DOI: 10.1587/elex.16.20190098
• ISSN: 13492543
• Web Site: https://www.jstage.jst.go.jp/article/elex/16/10/16_16.20190098/_pdf
• 本文言語コード: en
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