Micro Imprinting for Al Alloy Using Ni-W Electroformed Mold
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- Yasui Manabu
- Kanagawa Industrial Technology Center
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- Kaneko Satoru
- Kanagawa Industrial Technology Center
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- Takahashi Masaharu
- National Institute of Advanced Industrial Science and Technology (AIST)
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- Sano Takashi
- LEAP Co., Ltd
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- Hirabayashi Yasuo
- Kanagawa Industrial Technology Center
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- Ozawa Takeshi
- Kanagawa Industrial Technology Center
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- Maeda Ryutaro
- National Institute of Advanced Industrial Science and Technology (AIST)
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抄録
<p>We demonstrate the heat-resistant property of a Ni-W electroformed mold (Ni-W mold) used as the micro imprinting die for an Al alloy. To enhance the transfer performance of the Ni-W mold to A2017, we carried out micro imprinting for A2017 at 600°C. However, entire Ni-W patterns stuck to A2017. It is considered that Al, a major component of A2017, and Ni, a major component of a Ni-W mold, formed an intermetallic compound at 600°C.</p>
収録刊行物
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- International Journal of Automation Technology
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International Journal of Automation Technology 9 (6), 674-677, 2015-11-05
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