Growth Characteristics of Intermetallic Compounds on the Bond Interface of Magnesium-Clad Aluminum and Its Effect on Interface Properties

• Shu Jinfeng

  Department of Materials Science, Graduate School of Engineering, Kyushu Institute of Technology

• Yamaguchi Tomiko

  Department of Materials Science, Graduate School of Engineering, Kyushu Institute of Technology

抄録

　The Al/Mg clad materials were produced by vacuum roll bonding. After bonding, the clad materials were heat treated at different temperatures. The growth of intermetallic compounds on Al/Mg bond interface was investigated. The results show that the growth of intermetallic compounds was very slow at 200℃ and only Al₃Mg₂ layer with 2 μm thickness was observed after 3h. Al₃Mg₂ and Al₁₂Mg₁₇ intermetallic layers were formed at and above 300℃, and the growth activation energy of Al₃Mg₂ (86.18 kJ/mol) is smaller than that of Al₁₂Mg₁₇ (115.33 kJ/mol), so the growth of Al₃Mg₂ is faster and thicker. The thickness of intermetallic layer has a great influence on the tensile strength of Al/Mg interface. When the thickness of the intermetallic layer exceeded 20 μm, the tensile strength reduced to less than 6 Mpa. After 200℃ heat treatment, ductile fracture and brittle fracture occurred simultaneously at Al/Mg interface during tensile test. After heat treatment at and above 300℃, the fracture of Al/Mg interface occurred in the intermetallic layer and mainly in the Al₃Mg₂ layer, and the mode of fracture were cleavage fracture.

収録刊行物

• 軽金属溶接

  軽金属溶接 58 (Supplement), 107s-112s, 2020

  一般社団法人 軽金属溶接協会

キーワード

• Al/Mg interface
• Heat treatment
• Intermetallic compound
• Growth activation energy
• Tensile strength

詳細情報

• CRID: 1390848250104376576
• NII論文ID: 130007832378
• DOI: 10.11283/jlwa.58.107s
• ISSN: 2186618X
• ISSN: 03685306
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可