<i>In-Situ</i> N<sub>2</sub>-Plasma Nitridation for High-k HfN Gate Insulator Formed by Electron Cyclotron Resonance Plasma Sputtering
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- OHMI Shun-ichiro
- Tokyo Institute of Technology
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- ISHIMATSU Shin
- Tokyo Institute of Technology
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- HORIUCHI Yuske
- Tokyo Institute of Technology
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- KUDOH Sohya
- Tokyo Institute of Technology
Abstract
<p>We have investigated the in-situ N2-plasma nitridation for high-k HfN gate insulator formed by electron cyclotron resonance (ECR) plasma sputtering to improve the electrical characteristics. It was found that the increase of nitridation gas pressure for the deposited HfN1.1 gate insulator, such as 98 mPa, decreased both the hysteresis width in C-V characteristics and leakage current. Furthermore, the 2-step nitiridation process with the nitridation gas pressure of 26 mPa followed by the nitridation at 98 mPa realized the decrease of equivalent oxide thickness (EOT) to 0.9 nm with decreasing the hysteresis width and leakage current. The fabricated metal-insulator-semiconductor field-effect transistor (MISFET) with 2-step nitridation showed a steep subthreshold swing of 87 mV/dec.</p>
Journal
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- IEICE Transactions on Electronics
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IEICE Transactions on Electronics E103.C (6), 299-303, 2020-06-01
The Institute of Electronics, Information and Communication Engineers
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Details 詳細情報について
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- CRID
- 1390285300161214976
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- NII Article ID
- 130007850079
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- ISSN
- 17451353
- 09168524
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- Text Lang
- en
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
- KAKEN
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- Abstract License Flag
- Disallowed