Fabrication of Flexible Fine Through-hole Electrodes for Printed Devices using UV-NIL

• Honjo Kazuki

  Department of Applied Electronics, Tokyo University of Science

• Furuta Atsuhiro

  Department of Applied Electronics, Tokyo University of Science

• Taniguchi Jun

  Department of Applied Electronics, Tokyo University of Science

抄録

Demand for printed electronic devices is increasing, likewise the attention being paid to through-hole electrodes as an integration approach. In comparison with wire bonding integration methods, through-hole electrodes occupy smaller surface areas and have lower power consumption rates. Generally, the diameters of through-holes fabricated in flexible substrates are larger than those developed in rigid substrates. In this study, ultraviolet nanoimprint lithography was used to fabricate microscale through-holes in a flexible substrate, and these holes were subsequently filled with silver ink to form through-hole electrodes.

収録刊行物

• Journal of Photopolymer Science and Technology

  Journal of Photopolymer Science and Technology 33 (5), 545-550, 2020-07-01

  フォトポリマー学会

キーワード

• Through-hole electrode
• Silver ink
• Three-layer structure
• UV-NIL

詳細情報

• CRID: 1390285300171417728
• NII論文ID: 130007867664
• NII書誌ID: AA11576862
• DOI: 10.2494/photopolymer.33.545
• ISSN: 13496336
• ISSN: 09149244
• NDL書誌ID: 030413365
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I030413365
• Web Site: https://www.jstage.jst.go.jp/article/photopolymer/33/5/33_545/_pdf
• 本文言語コード: en
• データソース種別:
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  • NDL
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