Damage-less mechanical polishing technique for advanced crystal substrates using a resin pad and electric field-assisted polishing

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  • 樹脂パッドと電界砥粒制御技術を適用した先進結晶基板への低ダメージ機械研磨技術
  • ジュシ パッド ト デンカイトリュウ セイギョ ギジュツ オ テキヨウ シタ センシン ケッショウ キバン エ ノ テイダメージ キカイ ケンマ ギジュツ

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Abstract

<p>Diamond lapping is generally used as a shape creation method for advanced single-crystal substrates for electronic devices. However, a deep damaged layer is formed at the substrate surface in this process. The depth of this damaged layer affects the cost of the whole process. Here, a novel damage-less and high-efficiency mechanical polishing technique for advanced crystal substrates using a resin pad and electric field assisted polishing is proposed. This novel mechanical polishing method was compared with conventional diamond lapping with sapphire as the substrate. The mechanical polishing method using a resin pad reduced the damaged layer depth by approximately 0.16 times compared to the conventional process using a Cu platen. In addition, the removal rate was increased by 1.5 times by applying electric field-assisted polishing in comparison with the conventional lapping technique using a platen 910 mm in diameter. </p>

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