Effect of Thermo–Mechanical Treatment on Ductility of Cu–0.29wt%Zr Alloy Wires

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  • Kunimine Takahiro
    Division of Mechanical Science and Engineering, Graduate School of Natural Science and Technology, Kanazawa University
  • Miyamoto Kenta
    Division of Mechanical Science and Engineering, Graduate School of Natural Science and Technology, Kanazawa University
  • Nakashima Kao
    Division of Mechanical Science and Engineering, Graduate School of Natural Science and Technology, Kanazawa University Present：Tsudakoma Industry Co., Ltd.
  • Watanabe Chihiro
    Division of Mechanical Science and Engineering, Graduate School of Natural Science and Technology, Kanazawa University
  • Monzen Ryoichi
    Division of Mechanical Science and Engineering, Graduate School of Natural Science and Technology, Kanazawa University
  • Muramatsu Naokuni
    Research and Development, New Metals Division, NGK INSULATORS, LTD.
  • Ueno Shinya
    Development Division, SAN–ETSU METALS CO., LTD.

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Other Title
  • Cu–0.29wt％Zr合金線材の延性への加工熱処理の影響
  • Cu-0.29wt%Zr ゴウキン センザイ ノ エンセイ エ ノ カコウ ネツ ショリ ノ エイキョウ

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Abstract

<p>In our previous study, a thin wire of a Cu–0.29wt％Zr alloy was produced by annealing after rolling and then by two intermediate annealings during wire drawing（IA wire）. The IA wire had a value of ultimate tensile strength σu of 610 MPa, and had a small value of total elongation εt of 1.2％ despite a small value of grain size D of 240 nm. In this study, a thin wire of the alloy was produced by annealing after rolling and by subsequent wire drawing（S wire）. Even though the S wire had almost the same values of σu＝620 MPa and D＝230 nm as the IA wire, the S wire exhibited a larger value of εt＝2.9％. This study investigates the cause of the smaller value of εt for the IA wire. In both the IA and S wires, voids are formed by decohesion of the interface between the Cu matrix and particles consisting of eutectic phase（Cu＋Cu5Zr） during wire drawing； however, the fraction of the eutectic particles with voids is larger in the IA wire than in the S wire. The IA wire exhibits the lower ductility as a result of easier linking of the voids during tensile testing. In addition, the larger fraction of the eutectic particles with voids in the IA wire is attributed to the fact that the size of recrystallized grains generated by the intermediate annealing during wire drawing become larger than that of grains before the intermediate annealing, and during subsequent wire drawing, dislocations accumulate significantly around the eutectic particles, resulting in large stress concentration.</p>

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