High Reliability Packaging Technology of Direct Water Double Side Cooled Power Module

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  • 直接水冷型両面冷却パワーモジュールの高信頼実装技術
  • チョクセツ スイレイガタ リョウメン レイキャク パワーモジュール ノ コウシンライ ジッソウ ギジュツ

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Abstract

<p>The increasing demand for electric cars, which is part of the rapid progress toward a decarbonized society, has created the need for a reduction in the size and weight of high-output drive systems. Miniaturization requires a power module that efficiently dissipates the heat generated from power semiconductors. We have developed a direct water and double side cooled power module that efficiently transfers heat from both sides of the power semiconductor without passing through thermal grease. In doing so, the power density of the inverter was increased 1.6 times. In this report, in order to realize a power module structure that can be immersed in cooling water, the authors report on a bonding mounting technology that reliably attaches both sides of a power semiconductor to an aluminum CAN-shaped metal case. The developed technology has achieved approximately twice the reliability of conventional products and has been adopted in vehicles around the world.</p>

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