書誌事項
- タイトル別名
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- Development of Cu–Ni–Co–Si Alloys with Excellent Etching Characteristics
- エッチング カコウセイ ニ スグレタ Cu-Ni-Co-Siケイ コウキョウド ドウ ゴウキン ノ カイハツ
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抄録
<p>In order to produce thin and small semiconductor packages, leadframes with fine pitch and multi–pin are demanded. So, leadframe materials should possess higher strength, higher electrical conductivity, and excellent etching characteristics. In this study, we successfully developed novel Cu–Ni–Co–Si alloys for high–performed leadframes by optimizing thermomechanical process conditions. The Cu–Ni–Co–Si alloys have tensile strength of 1020 MPa, electrical conductivity of 38%IACS and high heat resistance, which overcome conventional leadframe materials of Cu–Ni–Si alloys. In addition, the Cu–Ni–Co–Si alloys exhibit an excellent etching characteristics comparable to conventional Cu–Ni–Si alloys. The excellent etching characteristics for the alloys can be explained by fine grain size rather than dislocation, precipitates, and grain orientation. Thus, the Cu–Ni–Co–Si alloys are promissing to be applied widely for thin and multi–pin leadframes in ultra–miniaturized communication and information devices.</p>
収録刊行物
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- 銅と銅合金
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銅と銅合金 60 (1), 256-261, 2021
日本銅学会
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詳細情報 詳細情報について
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- CRID
- 1390008613604083712
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- NII論文ID
- 130008117347
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- NII書誌ID
- AA11995570
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- ISSN
- 2435872X
- 13477234
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- NDL書誌ID
- 031637056
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- CiNii Articles
- KAKEN
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- 抄録ライセンスフラグ
- 使用可