Change in Microstructure and Electrical Resistivity of Cu–Zn alloy Due to Rolling

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  • Cu–Zn合金の圧延に伴う組織と電気抵抗率の変化
  • Cu-Zn ゴウキン ノ アツエン ニ トモナウ ソシキ ト デンキ テイコウリツ ノ ヘンカ

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Abstract

<p>In order to reveal the change in electrical resistivity and strengthening due to plastic deformation and microstructural evolution, investigation of mechanical and electrical properties was performed. From microstructural observations, it was found that the heterogeneous–nano structure having “eye”–shaped twin domains was formed of which volume fraction becomes largest at 90% of rolling reduction. Ultimate tensile strength increases with increasing rolling reduction and reaches about 735 MPa at 90% and 95% reductions. The electrical resistivity measured at 77 K changes from about 39.6 nΩm to about 61.9 nΩm, and correspondingly, the conductivity at 293 K changed from about 28.0%IACS down to about 19.9%IACS. When compare the total changes in electrical resistivity before and after reduction of 80%, the latter was larger. The more obvious changes in mechanical and electrical properties over reduction of 80% are associated with the formation of heterogeneous–nano structure in addition to increasing dislocation density.</p>

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