Self-organized ACP interconnection using wetting property of fusible fillers

• YASUDA K.

収録刊行物

• Proc. International Conference on Electronics Packaging, ICEP 2004

  Proc. International Conference on Electronics Packaging, ICEP 2004 125-140, 2004

詳細情報

• CRID: 1573387451148417920
• NII論文ID: 20000750663
• データソース種別:
  • CiNii Articles