The Atomic-Scale Removal Mechanism during Si Tip Scratching on Si and SiO2 Surfaces in Aqueous KOH with an Atomic Force Microscope.

  • Katsuki Futoshi
    Corporate Research and Development Laboratories, Sumitomo Metal Industries Limited., 1-8 Fuso-cho, Amagasaki 660-0891, Japan
  • Saguchi Akihiko
    Corporate Research and Development Laboratories, Sumitomo Metal Industries Limited., 1-8 Fuso-cho, Amagasaki 660-0891, Japan
  • Takahashi Wataru
    Corporate Research and Development Laboratories, Sumitomo Metal Industries Limited., 1-8 Fuso-cho, Amagasaki 660-0891, Japan
  • Watanabe Junji
    Graduate School of Science and Technology, Kumamoto University, 2-39-1 Kurokami, Kumamoto 860-8555, Japan

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  • Atomic Scale Removal Mechanism during Si Tip Scratching on Si and SiO2 Surfaces in Aqueous KOH with an Atomic Force Microscope
  • The Atomic-Scale Removal Mechanism during Si Tip Scratching on Si and SiO<sub>2</sub>Surfaces in Aqueous KOH with an Atomic Force Microscope

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Abstract

The atomic-scale removal mechanism during Si tip scratching on Si wafer or SiO2 film in aqueous KOH has been examined using an atomic force microscope. We have found that the Si tip removal volume in moles was in good agreement with that of the corresponding Si or SiO2 specimen. This equality implies that the process begins with formation of the Si-O-Si bridge between one Si atom of the tip and one Si atom or one SiO2 molecule of the specimen at the wear interface, followed by the local oxidation of the Si surface, and finally the bond rupture by the tip movement, the dimeric silica (OH)3Si-O-Si(OH)3, including the Si-O-Si bridge is dissolved in the KOH solution. Comparison of the wear behavior of Si and SiO2 shows that they are almost the same, indicating that a similar reaction would occur due to the local development of oxide nuclei on the Si surface.

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