Step Coverage Quality of Cu Films by Supercritical Fluid Deposition Compared with Chemical Vapor Deposition

• Takeshi Momose

• Masakazu Sugiyama

• Eiichi Kondoh

• Yukihiro Shimogaki

抄録

Feasibility of step coverage (SC) by supercritical fluid deposition (SCFD) of Cu was evaluated using a finite element method (FEM) simulation with experimentally estimated kinetics and transport properties of the precursor. This SC by Cu-SCFD was compared with that by chemical vapor deposition (CVD). SCFD showed superior SC, especially for ultra narrow features less than 1 µm wide, although CVD has a higher diffusion coefficient. This superior SC was due to the non-linear reaction kinetics of SCFD (CVD has linear reaction kinetics), where precursor concentration had negligible effect on growth rate when the precursor concentration was higher than about 1 mol/L.

収録刊行物

• Japanese Journal of Applied Physics

  Japanese Journal of Applied Physics 49 (5S2), 05FF01-, 2010-05-01

  IOP Publishing

キーワード

• General Physics and Astronomy
• General Engineering

詳細情報

• CRID: 1360284921832171392
• NII論文ID: 210000068539
• DOI: 10.1143/jjap.49.05ff01
• ISSN: 13474065
• ISSN: 00214922
• ISSN: http://id.crossref.org/issn/13474065
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.49.05FF01
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.49.05FF01/pdf
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