Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump

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Journal

  • Japanese Journal of Applied Physics

    Japanese Journal of Applied Physics 50(6), 06GM05-06GM05, 2011-06-20

    Japan Society of Applied Physics

Codes

  • NII Article ID (NAID)
    210000070770
  • ISSN
    0021-4922
  • Data Source
    Crossref 
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