Reactive Ion Etching of Carbon Nanowalls
Abstract
<jats:p> Two-dimensionally standing graphene sheets, i.e., carbon nanowalls (CNWs), were synthesized on a Si substrate employing a capacitively coupled fluorocarbon plasma-enhanced chemical vapor deposition system together with H radical injection. To apply CNWs in electronic devices and/or membrane filters, we have demonstrated the reactive ion etching (RIE) of CNWs. RIE employing H<jats:sub>2</jats:sub>/N<jats:sub>2</jats:sub> gases showed that the CNW films were anisotropically etched at a relatively high rate of more than 250 nm/min. However, the 10-nm-thick interface layer between a CNW film and the Si substrate remained and the interface layer was not completely etched. In contrast, RIE employing Ar/H<jats:sub>2</jats:sub> gases enabled us to completely remove the interface layer. Ar/H<jats:sub>2</jats:sub> RIE was also carried out from the bottom surface of CNW films after exfoliating them from the Si substrate. As a result, a free-standing CNW film of 550 nm thickness without an interface layer as a membrane filter was successfully formed. </jats:p>
Journal
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- Japanese Journal of Applied Physics
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Japanese Journal of Applied Physics 50 (7R), 075101-, 2011-07-01
IOP Publishing
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Details 詳細情報について
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- CRID
- 1360566396809774208
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- NII Article ID
- 210000070850
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- ISSN
- 13474065
- 00214922
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- Data Source
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- Crossref
- CiNii Articles