Room-Temperature Microjoining of LSI Chips on Poly(ethylene naphthalate) Film Using Mechanical Caulking of Au Cone Bump

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Journal

  • Japanese Journal of Applied Physics

    Japanese Journal of Applied Physics 51, 04DB04-04DB04, 2012-04-20

    Japan Society of Applied Physics

Codes

  • NII Article ID (NAID)
    210000072104
  • ISSN
    0021-4922
  • Data Source
    Crossref 
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