Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump

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Journal

  • Japanese Journal of Applied Physics

    Japanese Journal of Applied Physics 52(4S), 04CB10-04CB10, 2013-04-01

    IOP Publishing

Codes

  • NII Article ID (NAID)
    210000141986
  • ISSN
    0021-4922
  • Data Source
    Crossref 
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