Fabrication and Noise Reduction of the Miniature Tactile Sensor Using Through-Silicon-Via Connection with Signal Amplifier

• Hokuto Yokoyama

• Masayuki Sohgawa

• Takeshi Kanashima

• Teruaki Azuma

• Masanori Okuyama

• Haruo Noma

Abstract

A miniature tactile sensor has been fabricated by connecting stress-sensitive part with an amplifier of integrated circuit through through-silicon-via (TSV) electrically. The sensitive part consists of three warped cantilevers with piezoresistive NiCr thin film which are prepared on a silicon-on-insulator wafer by the surface micromachining technique. The TSV connection can reduce noise of detected change of the piezoresistive output induced by wire between the sensitive part and the amplifier. Fabricated tactile sensor of 5×5 mm 2 size has linear dependence of the output on both normal and shear forces. The output noise has been successfully decreased by 14 and 34% in the sensor using the TSVs compared with that using wires of 3 and 6 mm lengths, respectively.

Journal

• Japanese Journal of Applied Physics

  Japanese Journal of Applied Physics 52 (6S), 06GL08-, 2013-06-01

  IOP Publishing

Keywords

• General Physics and Astronomy
• General Engineering

Details

• CRID: 1360566399840586240
• NII Article ID: 210000142410
• DOI: 10.7567/jjap.52.06gl08
• ISSN: 13474065
• ISSN: 00214922
• Web Site: https://iopscience.iop.org/article/10.7567/JJAP.52.06GL08
• Web Site: https://iopscience.iop.org/article/10.7567/JJAP.52.06GL08/pdf
• Data Source:
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  • CiNii Articles
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