Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

• Sungho Lee

• Rui Liang

• Yuki Miwa

• Hisashi Kino

• Takafumi Fukushima

• Tetsu Tanaka

収録刊行物

• Japanese Journal of Applied Physics

  Japanese Journal of Applied Physics 59 (SB), SBBA04-, 2019-12-09

  IOP Publishing

キーワード

• General Physics and Astronomy
• Physics and Astronomy (miscellaneous)
• General Engineering

詳細情報

• CRID: 1360566399836386944
• NII論文ID: 210000157397
• DOI: 10.7567/1347-4065/ab4f3c
• ISSN: 13474065
• ISSN: 00214922
• Web Site: http://iopscience.iop.org/article/10.7567/1347-4065/ab4f3c
• Web Site: http://iopscience.iop.org/article/10.7567/1347-4065/ab4f3c/pdf
• Web Site: https://iopscience.iop.org/article/10.7567/1347-4065/ab4f3c/pdf
• Web Site: https://iopscience.iop.org/article/10.7567/1347-4065/ab4f3c
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