Analysis of millimeter‐wave amplifier module with surface wave mode transmission line by FDTD electromagnetic‐semiconductor device co‐simulation

• Ryo Ishikawa

• Kazuhiko Honjo

• Masayuki Nakajima

Abstract

Direct analysis of a millimeter‐wave amplifier module by using FDTD electromagnetic and semiconductor device co‐simulation technique is demonstrated. The millimeter‐wave amplifier module consists of an HFET and planar dielectric transmission lines (PDTL) for the 60‐GHz region. A PDTL with a surface wave transmission mode has a low‐loss transmission characteristic in the millimeter‐wave region when a low‐loss ceramic substrate is used. However, the transmission wave of the PDTL tends to be scattered by irregular structures and impedance mismatching. Furthermore, it is predicted that scattered waves reflected at the edges of the substrate will interfere with incident and transmission waves on the PDTL. Using the co‐simulation technique, the influence of the scattering waves is investigated in detail for the amplifier module. © 2010 Wiley Periodicals, Inc. Electron Comm Jpn, 93(3): 8–15, 2010; Published online in Wiley InterScience (<jats:ext-link xmlns:xlink="http://www.w3.org/1999/xlink" xlink:href="http://www.interscience.wiley.com">www.interscience.wiley.com ). DOI 10.1002/ecj.10211

Journal

• Electronics and Communications in Japan

  Electronics and Communications in Japan 93 (3), 8-15, 2010-02-22

  Wiley

Keywords

• Applied Mathematics
• Electrical and Electronic Engineering
• Computer Networks and Communications
• General Physics and Astronomy
• Signal Processing

Details

• CRID: 1364230498295913600
• NII Article ID: 210000177362
• DOI: 10.1002/ecj.10211
• ISSN: 19429541
• ISSN: 19429533
• Web Site: https://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2Fecj.10211
• Web Site: https://onlinelibrary.wiley.com/doi/pdf/10.1002/ecj.10211
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