The effect of additives on the electrodeposition of copper studied by the impedance technique

• G. Fabricius

• G. Sundholm

収録刊行物

• Journal of Applied Electrochemistry

  Journal of Applied Electrochemistry 14 (6), 797-801, 1984-11

  Springer Science and Business Media LLC

キーワード

• Materials Chemistry
• Electrochemistry
• General Chemical Engineering

詳細情報

• CRID: 1360581244947287808
• NII論文ID: 30013072096
• DOI: 10.1007/bf00615270
• ISSN: 15728838
• ISSN: 0021891X
• Web Site: http://link.springer.com/content/pdf/10.1007/BF00615270.pdf
• Web Site: http://link.springer.com/article/10.1007/BF00615270/fulltext.html
• Web Site: http://link.springer.com/content/pdf/10.1007/BF00615270
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