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- M. C. Bost
- Department of Electrical Engineering and Condensed Matter Sciences Laboratory, Colorado State University, Fort Collins, Colorado 80523
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- J. E. Mahan
- Department of Electrical Engineering and Condensed Matter Sciences Laboratory, Colorado State University, Fort Collins, Colorado 80523
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<jats:p>Iron disilicide thin films were prepared by furnace reaction of ion beam sputtered iron layers with single-crystal silicon wafers and with low-pressure chemical vapor deposition (LPCVD) polycrystalline silicon thin films. X-ray diffraction indicates the films are single-phase, orthorhombic, β-FeSi2. Impurity levels are below the detection limit of Auger spectroscopy. Normal incidence spectral transmittance and reflectance data indicate a minimum, direct energy gap of 0.87 eV. The apparent thermal activation energy of the resistivity in the intrinsic regime is about half of this minimum optical gap. With such a direct band gap, the material may be suitable for the development of both light-sensitive and light-emitting thin-film devices within the silicon microelectronics technology.</jats:p>
収録刊行物
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- Journal of Applied Physics
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Journal of Applied Physics 58 (7), 2696-2703, 1985-10-01
AIP Publishing
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詳細情報 詳細情報について
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- CRID
- 1363388846155090816
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- NII論文ID
- 30015829149
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- NII書誌ID
- AA00693547
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- DOI
- 10.1063/1.335906
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- ISSN
- 10897550
- 00218979
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