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- A. Kumar
- Martin Marietta Corporation, Denver, Colorado 80201
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- R. G. Kumble
- University of Connecticut, Storrs, Connecticut 06268
抄録
<jats:p>The mechanical behavior of OFHC copper at strain rates from 10−3 to 103 sec−1 at 300°, 420°, and 590°K was investigated. The strain rate behavior of copper can be divided into two regions. Below 10 sec−1 the dislocation motion is thermally activated over forest dislocation barriers. Above 103 sec−1, a linear relationship between stress and strain rate was observed indicating the presence of a viscous damping mechanism. The stress level τB that must be exceeded in order to obtain viscous behavior depends on the work-hardened state of the copper. The mobile dislocation density in the viscous damping region was found to be (1) independent of strain rate, (b) only a small fraction (10−5) of the total dislocation density, (c) independent of strain, and (d) increased with increasing temperature. These deductions are discussed in terms of the dislocation multiplication and annihilation mechanism.</jats:p>
収録刊行物
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- Journal of Applied Physics
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Journal of Applied Physics 40 (9), 3475-3480, 1969-08-01
AIP Publishing
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詳細情報 詳細情報について
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- CRID
- 1361418519371970176
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- NII論文ID
- 30015890743
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- ISSN
- 10897550
- 00218979
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- データソース種別
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