The Characterization of Via‐Filling Technology with Electroless Plating Method

• Yusuke Harada

  Oki Electric Industry Company, Limited, Hachioji, Tokyo 193, Japan

• Kimihisa Fushimi

  Oki Electric Industry Company, Limited, Hachioji, Tokyo 193, Japan

• Shoji Madokoro

  Oki Electric Industry Company, Limited, Hachioji, Tokyo 193, Japan

• Hideo Sawai

  Oki Electric Industry Company, Limited, Hachioji, Tokyo 193, Japan

• Shintaro Ushio

  Oki Electric Industry Company, Limited, Hachioji, Tokyo 193, Japan

収録刊行物

• Journal of The Electrochemical Society

  Journal of The Electrochemical Society 133 (11), 2428-2430, 1986-11-01

  The Electrochemical Society

キーワード

• Materials Chemistry
• Electrochemistry
• Surfaces, Coatings and Films
• Condensed Matter Physics
• Renewable Energy, Sustainability and the Environment
• Electronic, Optical and Magnetic Materials

詳細情報

• CRID: 1363107371319440640
• NII論文ID: 30016158721
• DOI: 10.1149/1.2108421
• ISSN: 19457111
• ISSN: 00134651
• ISSN: http://id.crossref.org/issn/00134651
• Web Site: https://iopscience.iop.org/article/10.1149/1.2108421
• Web Site: https://iopscience.iop.org/article/10.1149/1.2108421/pdf
• データソース種別:
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  • CiNii Articles