Cu/photosensitive-BCB thin-film multilayer technology for high-performance multichip modules
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収録刊行物
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- IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
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IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 18 (1), 18-22, 1995
Institute of Electrical and Electronics Engineers (IEEE)
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詳細情報 詳細情報について
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- CRID
- 1363670318968795392
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- NII論文ID
- 30020058936
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- NII書誌ID
- AA10997934
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- ISSN
- 10709894
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- データソース種別
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