Patterning performance of EB-X3 x-ray mask writer

  • Shigehisa Ohki
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Toshifumi Watanabe
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Yuji Takeda
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Tetsuo Morosawa
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Kenichi Saito
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Tatsuya Kunioka
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Junichi Kato
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Akira Shimizu
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Tadahito Matsuda
    NTT Telecommunications Energy Laboratories, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Shinji Tsuboi
    ASET Super-fine SR Lithography Laboratory, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Hajime Aoyama
    ASET Super-fine SR Lithography Laboratory, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Hiroshi Watanabe
    ASET Super-fine SR Lithography Laboratory, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan
  • Yoshinori Nakayama
    ASET Super-fine SR Lithography Laboratory, 3-1, Morinosato Wakamiya, Atsugi-shi, Kanagawa 243-0198, Japan

抄録

<jats:p>An intensive study of the patterning performance of the EB-X3 revealed that the placement accuracy of a written image was degraded by the thermal effect originating from the temperature difference between the stage and the palette. An optimal writing procedure consisting of two temperature stabilization steps was developed. This procedure enables the EB-X3 to attain an image placement accuracy of better than 10 nm (3σ). A critical dimension control of 7.4 nm (3σ) has been confirmed over a 25-mm-square field.</jats:p>

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