Material Consideration on Ta, Mo, Ru, and Os as Glue Layer for Ultra Large Scale Integration Cu Interconnects

• Hoon Kim

• Yasushi Naito

• Toshihiko Koseki

Bibliographic Information

Other Title

• Material Consideration on Ta Mo Ru and Os as Glue Layer for Ultra Large Scale Integration Cu Interconnects

Abstract

コレクション : 国立国会図書館デジタルコレクション > デジタル化資料 > 雑誌

Journal

• Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP

  Japanese journal of applied physics. Part. 1, Regular papers, brief communications & review papers : JJAP 45 (4A), 2497-2501, 2006-04

  Tokyo : Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physics

Keywords

• interconnect
• Cu wettability
• lattice misfit
• interface
• adhesion
• reliability

Details

• CRID: 1520853833467678080
• NII Article ID: 40007227456
• NII Book ID: AA10457675
• ISSN: 00214922
• ISSN: 13474065
• DOI: 10.1143/jjap.45.2497
• NDL BIB ID: 7882397
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I7882397
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.45.2497
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.45.2497/pdf
• Text Lang: en
• NDL Source Classification:
  • ZM35(科学技術--物理学)
• Data Source:
  • NDL
  • Crossref
  • CiNii Articles