Study of bonding technology using silver nanoparticles

• Toshiaki Morita

• Eiichi Ide

• Yusuke Yasuda

Abstract

コレクション : 国立国会図書館デジタルコレクション > デジタル化資料 > 雑誌

Journal

• Japanese journal of applied physics : JJAP

  Japanese journal of applied physics : JJAP 47 (8), 6615-6622, 2008-08

  Tokyo : The Japan Society of Applied Physics

Keywords

• silver
• nanoparticle
• bonding
• thermal diffusion
• heat resistance

Details

• CRID: 1520290882134915712
• NII Article ID: 40016211065
• NII Book ID: AA12295836
• ISSN: 00214922
• ISSN: 13474065
• DOI: 10.1143/jjap.47.6615
• NDL BIB ID: 9623371
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I9623371
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.47.6615
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.47.6615/pdf
• Text Lang: en
• NDL Source Classification:
  • ZM35(科学技術--物理学)
• Data Source:
  • NDL
  • Crossref
  • CiNii Articles