High Temperature Characterization of Binary and Ternary Bi Alloys Microalloyed with Cu and Ag
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- Yu Meiqi
- Department of Mechanical Materials Engineering, Hiroshima University
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- Matsugi Kazuhiro
- Department of Mechanical Materials Engineering, Hiroshima University
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- Xu Zhefeng
- Department of Mechanical Materials Engineering, Hiroshima University
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- Choi Yongbum
- Department of Mechanical Materials Engineering, Hiroshima University
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- Yu Jinku
- State Key Laboratory of Metastable Materials Science and Technology, Yanshan University
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- Motozuka Satoshi
- Department of Mechanical Engineering, National Institute of Technology, Gifu College
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- Nishimura Yoshiyuki
- Engineering Department, OM Sangyo Co. Ltd.
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- Suetsugu Ken-ichiro
- Center for Environmental Management, Kobe University
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<p>The s-orbital energy level (Mk) of alloying elements in a Bi cluster was used to determine the composition for alloys of this system for use as Pb-free high-temperature solders. Binary Bi-Cu and Bi-Ag alloys with ⊿Mk of 0.013–0.343 and ternary Bi-2.0Ag-0.5Cu and Bi-5.0Ag-0.5Cu alloys with ⊿Mk of 0.180 and 0.379, respectively, were fabricated and tensile tested at 423 K; here, ⊿Mk is the compositional average of Mk. The flow stress and fracture strain at 423 K increased after the alloying elements were added to the alloys. The relationships between the 0.2% proof stress, ultimate tensile strength or fracture strain, and ⊿Mk were similar to those determined previously through tests performed at 293 K. Thus, these relationships could be useful for predicting the stress and fractures strain levels based on ⊿Mk, regardless of the temperature and alloy composition. Moreover, a transition from ductility to brittleness was observed at 348–373 K for both ternary alloys. In addition, the melting points of the ternary alloys lay between 536 and 538 K, indicating that the alloys would be suitable as high-temperature solders. The contact angles of molten droplets of 10 of the experimental binary and ternary alloys on a Cu plate as determined at 973 K were 24–30°. This confirmed that the alloys exhibited good wettability with respect to Cu. Finally, the ternary Bi-2.0Ag-0.5Cu and Bi-5.0Ag-0.5Cu alloys showed thermal conductivities of 12.1 and 15.9 W/m/K, respectively, at 373 K; these were lower than that (30.4 W/m/K) of Pb-5Sn.</p>
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 59 (2), 303-310, 2018
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390282679229105536
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- NII論文ID
- 130006318934
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- NII書誌ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 028793240
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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