Study on new development of porous metal bonded diamond wheel and its grinding performance

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著者

    • Truong, Son H チュン, ソン ホアン

書誌事項

タイトル

Study on new development of porous metal bonded diamond wheel and its grinding performance

著者名

Truong, Son H

著者別名

チュン, ソン ホアン

学位授与大学

立命館大学

取得学位

博士 (工学)

学位授与番号

甲第166号

学位授与年月日

2000-03-31

注記・抄録

博士論文

目次

  1. Contents / p1 (0003.jp2)
  2. 1 Introduction / p5 (0005.jp2)
  3. 1.1 Common wheels in manufacturing / p5 (0005.jp2)
  4. 1.2 Metal bonded diamond wheel / p6 (0006.jp2)
  5. 1.3 Present situation of porous metal bonded diamond wheel(PMBDW) / p9 (0007.jp2)
  6. 1.4 The goal of this study and the composition of this thesis / p10 (0008.jp2)
  7. References / p12 (0009.jp2)
  8. Part1 How to Make Porous Metal Bonded Diamond Wheel / p14 (0010.jp2)
  9. 2 Manufacturing Process of PMBDW from the Electroplating Metal Coated Abrasive Grain / p15 (0011.jp2)
  10. 2.1 Manufacture of PMBDW / p15 (0011.jp2)
  11. 2.2 Measurement and calculation of mechanical properties of bond bridge / p22 (0014.jp2)
  12. References / p23 (0015.jp2)
  13. 3 A Trial of Bond Bridge Formation with Extracted Metals from Colloidal Solution / p24 (0015.jp2)
  14. 3.1 Introduction / p24 (0015.jp2)
  15. 3.2 Principal of metal extraction from colloidal liquid / p24 (0015.jp2)
  16. 3.3 Experimental procedures / p25 (0016.jp2)
  17. 3.4 Results of extraction,reaction and sintering / p25 (0016.jp2)
  18. 3.5 Conclusions / p29 (0018.jp2)
  19. References / p31 (0019.jp2)
  20. Part2 How to Improve the Mechanical Properties of Bond Bridge / p32 (0019.jp2)
  21. 4 A Study on the Toughening of Bond Bridge of Ni-Cu Sn Alloy / p33 (0020.jp2)
  22. 4.1 Introduction / p33 (0020.jp2)
  23. 4.2 Experimental procedures / p33 (0020.jp2)
  24. 4.3 Analysis on the strength of bond bridge / p35 (0021.jp2)
  25. 4.4 Calculation of radius of bond bridge / p37 (0022.jp2)
  26. 4.5 Influences of the vacuum sintering conditions on mechanical properties of bond bridge / p38 (0022.jp2)
  27. 4.6 Influences of heat treatment and sub-zero treatment on mechanical properties of bond bridge / p42 (0024.jp2)
  28. 4.7 Investigation of the toughening mechanism / p48 (0027.jp2)
  29. 4.8 Conclusions / p50 (0028.jp2)
  30. References / p51 (0029.jp2)
  31. 5 Scanning Electron Microscopic Study and Mechanical Property Examination of a Bond Bridge / p52 (0029.jp2)
  32. 5.1 Introduction / p52 (0029.jp2)
  33. 5.2 Experimental procedure / p52 (0029.jp2)
  34. 5.3 SEM observations and mechanical properties / p52 (0029.jp2)
  35. 5.4 Conclusions / p67 (0037.jp2)
  36. References / p68 (0037.jp2)
  37. 6 Some Effects of Over Coated Metal for the Mechanical Property Improvement of Bond Bridge / p69 (0038.jp2)
  38. 6.1 Introduction / p69 (0038.jp2)
  39. 6.2 Fundamental concept of over coated metal / p69 (0038.jp2)
  40. 6.3 Experimental procedure and calculation / p70 (0038.jp2)
  41. 6.4 Some effects of over coated metal and discussion / p73 (0040.jp2)
  42. 6.5 Conclusions / p76 (0041.jp2)
  43. References / p77 (0042.jp2)
  44. Part3 Grinding Performance of PMBDW / p78 (0042.jp2)
  45. 7 Experimental Study on Grinding Performance / p79 (0043.jp2)
  46. 7.1 Introduction / p79 (0043.jp2)
  47. 7.2 Experimental procedures / p79 (0043.jp2)
  48. 7.3 Influence of wheel pore rate on wheel surface conditions / p80 (0043.jp2)
  49. 7.4 Grinding performance and characteristics of wheel / p85 (0046.jp2)
  50. 7.5 Conclusions / p92 (0049.jp2)
  51. References / p93 (0050.jp2)
  52. 8 Investigation on Thermal Changes of Workpiece in Cool Air Grinding / p94 (0050.jp2)
  53. 8.1 Introduction / p94 (0050.jp2)
  54. 8.2 Analytical procedures / p94 (0050.jp2)
  55. 8.3 Experimental procedures / p99 (0053.jp2)
  56. 8.4 Experiment results and discussions / p101 (0054.jp2)
  57. 8.5 Conclusions / p108 (0057.jp2)
  58. References / p109 (0058.jp2)
  59. Appendix1 / p110 (0058.jp2)
  60. Appendix2 / p110 (0058.jp2)
  61. 9 Concluding Remarks / p112 (0059.jp2)
  62. 9.1 Results of this thesis / p112 (0059.jp2)
  63. 9.2 Further research topics / p113 (0060.jp2)
  64. Acknowledgement / p114 (0060.jp2)
  65. Published Papers and Short Articles by the Author / p115 (0061.jp2)
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各種コード

  • NII論文ID(NAID)
    500000189084
  • NII著者ID(NRID)
    • 8000000189367
  • DOI(NDL)
  • NDL書誌ID
    • 000000353398
  • データ提供元
    • NDL ONLINE
    • NDLデジタルコレクション
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