Board-level interconnection reliability of lead-free area array packages with various reworkable polymeric reinforcement materials

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Author

    • 史, 洪賓 シ, コウヒン

Bibliographic Information

Title

Board-level interconnection reliability of lead-free area array packages with various reworkable polymeric reinforcement materials

Author

史, 洪賓

Author(Another name)

シ, コウヒン

University

早稲田大学

Types of degree

博士(工学)

Grant ID

甲第3794号

Degree year

2013-03-15

Note and Description

博士論文

Codes

  • NII Article ID (NAID)
    500000574509
  • NII Author ID (NRID)
    • 8000000576837
  • Text Lang
    • eng
  • NDLBibID
    • 024801797
  • Source
    • NDL ONLINE

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