Mirror Surface Grinding of Silicon Wafers with Electrolytic In-Process Dressing

• H. Ohmori

• T. Nakagawa

収録刊行物

• CIRP Annals

  CIRP Annals 39 (1), 329-332, 1990

  Elsevier BV

キーワード

• Industrial and Manufacturing Engineering
• Mechanical Engineering

詳細情報

• CRID: 1360011145066620032
• NII論文ID: 80005383912
• DOI: 10.1016/s0007-8506(07)61065-8
• ISSN: 00078506
• ISSN: http://id.crossref.org/issn/00078506
• Web Site: https://api.elsevier.com/content/article/PII:S0007850607610658?httpAccept=text/xml
• Web Site: https://api.elsevier.com/content/article/PII:S0007850607610658?httpAccept=text/plain
• データソース種別:
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  • CiNii Articles