Encapsulants Used in Flip-Chip Packages

• SURYANARAYANA D.

収録刊行物

• IEEE Transactions on Components, Hybrids, and Manufacturing Technology

  IEEE Transactions on Components, Hybrids, and Manufacturing Technology 16 (8), 1993

詳細情報

• CRID: 1571135651666863104
• NII論文ID: 80007587133
• NII書誌ID: AA00667751
• データソース種別:
  • CiNii Articles