Microstructure-Electromigration Correlation in a Thin Stripe of Eutectic SnPb Solder Stressed between Cu Electrodes

• LIU C. Y.

収録刊行物

• Journal of Applied Physics

  Journal of Applied Physics 88 5703-5709, 2000

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• CRID: 1571417125015008000
• NII論文ID: 80012090711
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  • CiNii Articles