Effects of Cu, Ag and Sb on the Creep-Rupture Strength of Lead-Free Solder Alloys

• WADA N.

収録刊行物

• J of Electronic Matelials

  J of Electronic Matelials 31 1228-1231, 2001

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• CRID: 1572824499900540032
• NII論文ID: 80012532241
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